Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management
By: and and and and and
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- Synopsis
- This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
- Copyright:
- 2017
Book Details
- Book Quality:
- Publisher Quality
- Book Size:
- 265 Pages
- ISBN-13:
- 9783527697045
- Related ISBNs:
- 9783527697052, 9783527697052, 9783527338559
- Publisher:
- Wiley
- Date of Addition:
- 10/13/19
- Copyrighted By:
- N/A
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- Paul D. Franzon
- Edited by:
- Erik Jan Marinissen
- Edited by:
- Muhannad S. Bakir
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