Handbook of 3D Integration, Volume 3: 3D Process Technology
By: and and
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- Synopsis
- Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
- Copyright:
- 2014
Book Details
- Book Quality:
- Publisher Quality
- Book Size:
- 474 Pages
- ISBN-13:
- 9783527670130
- Related ISBNs:
- 9783527670109, 9783527334667
- Publisher:
- Wiley
- Date of Addition:
- 11/06/19
- Copyrighted By:
- N/A
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- Philip Garrou
- Edited by:
- Mitsumasa Koyanagi
- Edited by:
- Peter Ramm
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- by Philip Garrou
- by Mitsumasa Koyanagi
- by Peter Ramm
- in Nonfiction
- in Technology