Foldable Flex and Thinned Silicon Multichip Packaging Technology (2003) (Emerging Technology in Advanced Packaging #1)
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- Synopsis
- Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
- Copyright:
- 2003
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9781461502319
- Related ISBNs:
- 9780792376767
- Publisher:
- Springer US
- Date of Addition:
- 01/08/21
- Copyrighted By:
- N/A
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Science, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- John W. Balde