Carbon Nanotubes for Interconnects Process, Design and Applications

You must be logged in to access this title.

Sign up now

Already a member? Log in

Synopsis

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Book details

Author:
Aida Todri-Sanial, Jean Dijon, Antonio Maffucci
ISBN:
9783319297460
Related ISBNs:
9783319297446
Publisher:
Springer International Publishing
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2018-09-28
Usage restrictions:
Copyright
Copyright date:
2017
Copyright by:
Springer International Publishing, Cham 
Adult content:
No
Language:
English
Categories:
Computers and Internet, Nonfiction, Technology