RF and Microwave Microelectronics Packaging II

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Synopsis

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Book details

Author:
Ken Kuang, Rick Sturdivant
ISBN:
9783319516974
Related ISBNs:
9783319516967
Publisher:
Springer International Publishing
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2018-10-03
Usage restrictions:
Copyright
Copyright date:
2017
Copyright by:
Springer International Publishing, Cham 
Adult content:
No
Language:
English
Categories:
Nonfiction, Technology