Heterogeneous Integrations

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Synopsis

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Book details

Edition:
1st ed. 2019
Author:
John H. Lau
ISBN:
9789811372247
Related ISBNs:
9789811372230
Publisher:
Springer Singapore, Singapore
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2019-04-10
Usage restrictions:
Copyright
Copyright date:
2019
Copyright by:
Springer Nature Singapore Pte Ltd. 
Adult content:
No
Language:
English
Categories:
Nonfiction, Technology