Modeling and Application of Flexible Electronics Packaging

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Synopsis

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Book details

Edition:
1st ed. 2019
Author:
YongAn Huang, Zhouping Yin, Xiaodong Wan
ISBN:
9789811336270
Related ISBNs:
9789811336263
Publisher:
Springer Singapore, Singapore
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2019-04-26
Usage restrictions:
Copyright
Copyright date:
2019
Copyright by:
Science Press and Springer Nature Singapore Pte Ltd. 
Adult content:
No
Language:
English
Categories:
Computers and Internet, Nonfiction, Technology