RF and Microwave Microelectronics Packaging

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Synopsis

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Book details

Edition:
2010
Author:
Ken Kuang, Franklin Kim, Sean S. Cahill
ISBN:
9781441909848
Related ISBNs:
9781441909831
Publisher:
Springer US
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2019-08-16
Usage restrictions:
Copyright
Copyright date:
2010
Copyright by:
Springer US, Boston, MA 
Adult content:
No
Language:
English
Categories:
Nonfiction, Technology