High-Frequency Characterization of Electronic Packaging
Synopsis
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.Book details
- Edition:
- 1998
- Series:
- Electronic Packaging and Interconnects (Book 1)
- Author:
- Luc Martens
- ISBN:
- 9781461556237
- Related ISBNs:
- 9780792383079
- Publisher:
- Springer US
- Pages:
- N/A
- Reading age:
- Not specified
- Includes images:
- Yes
- Date of addition:
- 2021-01-17
- Usage restrictions:
- Copyright
- Copyright date:
- 1998
- Copyright by:
- Springer Science+Business Media New York 1998
- Adult content:
- No
- Language:
- English
- Categories:
- Nonfiction, Technology