Semiconductor Advanced Packaging

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Synopsis

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Book details

Edition:
1st ed. 2021
Author:
John H. Lau
ISBN:
9789811613760
Related ISBNs:
9789811613753
Publisher:
Springer Singapore, Singapore
Pages:
N/A
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2021-06-17
Usage restrictions:
Copyright
Copyright date:
2021
Copyright by:
The Editor 
Adult content:
No
Language:
English
Categories:
Nonfiction, Technology