Through Silicon Vias Materials, Models, Design, and Performance

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Synopsis

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Book details

Author:
Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam
ISBN:
9781315351797
Related ISBNs:
9781498745529, 9781315368825, 9780367574543
Publisher:
CRC Press
Pages:
216
Reading age:
Not specified
Includes images:
Yes
Date of addition:
2023-09-17
Usage restrictions:
Copyright
Copyright date:
2017
Copyright by:
Taylor & Francis Group, LLC 
Adult content:
No
Language:
English
Categories:
Nonfiction, Science, Technology